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This event is co-located with a conference on quantum dots.
May 5, 2021
By: Anthony Locicero
TechBlick’s third virtual conference and exhibition on May 11-12 will cover Printed, hybrid, structural and 3D electronics.Â
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This event is co-located with a conference on quantum dots, which covers the latest material innovations and emerging applications.
The speaker and panelist line-up feature leading global organizations, including Boeing, Airbus, Coca-Cola, P&G, HP, ARM, Wuerth, Signify, US Army, Panasonic, Parsons, Texas Instruments, Identiv, Kimoto, Agfa, and many others.Â
In total, you can expect 65 LIVE presentations covering all the key aspects of these fields. To read more please click here
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